Philippe Monnoyer

Philippe Monnoyer, Dr.Sc.

Deep-Tech Strategist · SEMI Hall of Fame Inductee 2024

Bridging the gap between world-class R&D and industrial commercialization. Specializing in MEMS, Hyperspectral Imaging, and Optical Sensors for HealthTech and Industry 4.0.

About Me

From the Cleanroom to the Boardroom

I am a deep-tech strategist bridging the gap between world-class R&D and industrial commercialization. As a SEMI Hall of Fame Inductee (2024) and Commercial Lead at VTT, my mission is to take complex innovations—specifically in MEMS, Hyperspectral Imaging (HSI), and Optical Sensors—and translate them into scalable solutions for HealthTech and Industry 4.0.

With a PhD in Chemistry and a career spanning Motorola, Freescale, and imec, I have moved from the cleanroom to the boardroom. I understand the physics of the sensor, the challenges of microfabrication, and the business logic required to bring them to market.

I am passionate about the revolution in imaging powered by AI. If you are working on the future of spectral sensing, let's connect.

  • Hyperspectral & AI

    Driving the shift from bulky cameras to handheld, AI-powered diagnostic tools.

  • Ecosystem Leadership

    Chair of the SEMI MEMS & Imaging Sensor Summit. Industrial Liaison for IEEE-WHISPERS.

  • Medical Technology

    Leveraging spectral sensing for non-invasive diagnostics and next-gen healthcare.

  • Community Building

    Founder of the Lippmann Award. Active member of SEMI MSTC and MSEC executive committees.

Curriculum Vitae

Education

PhD in Chemistry

University of Namur, Belgium

Expertise

  • MEMS & Sensors
  • Hyperspectral Imaging
  • Optical Sensors
  • Microlithography
  • CMP Process Development
  • Semiconductor Manufacturing
  • Technology Commercialization

Awards & Recognition

  • SEMI Hall of Fame Inductee (2024)
  • Founder, Lippmann Award

Industry Roles

  • Chair, SEMI MEMS & Imaging Sensor Summit
  • Industrial Liaison, IEEE-WHISPERS
  • Member, SEMI MSTC Executive Committee
  • Member, SEMI MSEC Executive Committee

IMD Alumni Club of Finland

Board Member

March 2026 – Present

IEEE

WHISPERS Hyperspectral Imaging Conference — Industry Liaison

Jan 2025 – Present

WHISPERS Hyperspectral Imaging Conference — General Chair

Jul 2024 – Jul 2025

SEMI

MEMS and Sensors Executive Congress (MSEC) — Executive Committee Member

Oct 2023 – Present

MEMS and Imaging Sensors Summit — Conference Chair

Sep 2023 – Present

MEMS and Sensors Technical Congress (MSTC) — Executive Committee Member

May 2021 – Present

VTT

Customer Account Lead — Hyperspectral & Microelectronics

Mar 2018 – Present
Finland

Leading commercial initiatives for tunable Fabry-Pérot Interferometer (FPI) technologies. Deep-tech commercialization in Precision Agriculture, Remote Sensing, and Medical Diagnostics. Founder of the Lippmann Award. Selected as Lecturer for NATO Summer School on Sensing Technology (2024).

Business Development Manager

Sep 2016 – Feb 2018
Espoo, Finland

Hyperspectral imaging, MEMS and sensors, printed biosensors, integration.

Head of Research Area — Microelectronic Systems

Jan 2014 – Aug 2016
Espoo, Finland

Operational management of VTT silicon activities and cleanroom facilities.

Technology Manager

Sep 2010 – Dec 2013

Microsystems and Nanoelectronics.

Team Manager

Sep 2008 – Aug 2010

3D Integration team — state-of-the-art techniques for 3D stacking of planar devices interconnected using through-silicon vias (TSV). Wafer thinning, bumping, bonding, flip chip bonding, dicing, cavity SOI wafers, and radiation sensors.

Senior Research Scientist

Oct 2007 – Aug 2010

MEMS and heterogeneous integration.

Freescale Semiconductor

Materials Scientist

Jul 2004 – Sep 2007

Development of chemical formulations for chemical mechanical polishing and cleaning. Elaboration of CMP slurry acceptance test analytical protocols. Work done at CEA/Leti in Grenoble and at the Freescale/NXP/ST Alliance in Crolles, France.

IMEC

Research Scientist

Jan 2002 – Jul 2004

Microlithography.

Centre Spatial de Liège

Project Manager

Sep 1998 – Dec 2001

Preparation of ultra-high resolution silver halide gelatin holographic recording plates. Business orientation, government funding, market studies and business planning.

Harvard University

Invited Researcher — Analog Hyperspectral Imaging

Aug 1999 – Sep 1999
The Rowland Institute at Harvard, Cambridge, MA, USA

Fabrication and characterization of historical Lippmann photographic emulsions and related recording media for interferential true color photography.

Selected Work

Click on a category to explore

Method and Apparatus for Calibrating a Spectral Imaging Device
WO2023062275 · 2023
A Device for Non-Invasive Monitoring
WO2022301240 · 2022
"Universal" Barrier CMP Slurry for Use with Low Dielectric Constant Interlayer Dielectrics
WO2007087831A1 · 2007
Barrier Slurry Compositions and Barrier CMP Methods
WO2007102138A3 · 2007
Coupling Layer Composition for a Semiconductor Device
US20160172240A1 · 2016
Rinse Formulation for Use in the Manufacture of an Integrated Circuit
US20100273330A1 · 2010
Method for Testing a Slurry Used to Form a Semiconductor Device
US8061185B2
NATO Science & Technology Organisation – Lecture at the NATO Summer School
Helsinki, 2024 · Watch Video
Making Hyperspectral Imaging Accessible to All
Optics & Photonics Days · Helsinki, May 2024
Hyperspectral Imaging: Vision Redefined for a Technicolor Future
Scandinavian Sensor Summit · Horten, Norway, Sept 2023 · Watch Video
Bridging the Spectrum: Making Hyperspectral Imaging Accessible to All
IEEE-WHISPERS Hyperspectral Imaging Conference · Athens, 2023
Hyperspectral SWIR Imaging for Consumers
SEMI MEMS & Imaging Sensors Summit · Grenoble, 2022
EPIC Technology Meeting on Hyperspectral Imaging
2020
A Spectrometer in Each Pixel
EPIC Meeting in Vision · 2018
Sensing Technology for Food and Agriculture
Sensors in Food and Agriculture · Cambridge, 2016
Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, H., et al. · IEEE ESTC · 2014
Wafer-level SLID bonding for MEMS encapsulation
Xu, H., et al. · Adv. Manuf. · 2013
Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias
P. Dixit, et al. · IEEE IMPACT · 2013
Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, H., et al. · European Microelectronics Packaging Conference · 2013
Screening of ALD thin films for Cu diffusion barrier applications
R. L. Puurunen, et al. · American Vacuum Society · 2013
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Xu, H., et al. · European Microelectronics Packaging Conference · 2013
Modeling of the underfill flow process in the flip chip bonded pixel detectors
A. Gädda, et al. · IMAPS Nordic Conference · 2012
Role of process gases in making tapered through-silicon vias for 3D MEMS packaging
P. Dixit, et al. · IEEE IMPACT · 2012
Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias
P. Dixit, et al. · J. Micromech. Microeng. · 2012
Effect of Process Gases on Fabricating Tapered Through-Silicon Vias by Continuous SF6/O2/Ar Plasma Etching
P. Dixit, et al. · ECS J. Solid State Sci. Technol. · 2012
The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step
P. Dixit, et al. · J. Micromech. Microeng. · 2011
Low-temperature bump bonding of Timepix readout chips and CdTe sensors at different sensor pitches
H. Heikkinen, et al. · IEEE Nuclear Science Symposium · 2011
Electroless Nickel and Immersion Gold deposition on Single Chips for Flip Chip Assembly of Pixel Detectors
A. Gädda, et al. · IMAPS Nordic Annual Conference · 2011
Indium-tin bump deposition for the hybridization of CdTe sensors and readout chips
H. Heikkinen, et al. · IEEE Nuclear Science Symposium & Medical Imaging Conference · 2010
Optical extensions towards the 45-nm node
E. Hendrickx, P. Monnoyer, et al. · Proc. SPIE · 2004
ArF solutions for low-k1 back-end imaging
V. Wiaux, P. Monnoyer, et al. · Proc. SPIE · 2003
Préparation de nanoparticules d'halogénures et de chalcogénures d'argent en microémulsion
Ph. Monnoyer · Ph.D. Thesis, University of Namur · 1998
Structural Characterization of Colloidal Ag2Se Nanocrystals
V. Buschmann, Ph. Monnoyer, et al. · Langmuir · 1998
Preparation of colloidal nanocrystals of AgX and Ag2Se from microemulsions
Ph. Monnoyer, et al. · Colloids Surf. A · 1996
Nanoparticles in microemulsions: a general approach
J.B. Nagy, et al. · Nanoparticles in Solids and Solutions (Kluwer) · 1996
Preparation of colloidal AgBr particles from microemulsions
Ph. Monnoyer, et al. · Colloids and Surfaces A · 1995
Préparation de particules de bromure d'argent monodisperses en microémulsion AOT-heptane-eau
Ph. Monnoyer · M.Sc. Thesis, University of Namur · 1993
Announcing 2025 Lippmann Award Winner: Hypervision
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Non-Invasive CGM Technology: Who's in the Race?
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New Year's Resolutions: What About Measuring Some Data?
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Announcing Kuva Space – Winner of the Lippmann Award 2024
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The Imaging Revolution at VTT
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The Revolution in Continuous Glucose Monitoring
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Skin Cancer: New Technology from Finland
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Fine Art Photography
Small and large format film photography · 19th century photographic printing processes: silver halides, palladiotype, chrysotype, Prussian blue
Nutrition Science
Metabolic health and related technologies
AI for Business
Vibe coding for productivity
Technology Trends and Innovation Mapping

Get in Touch

I am passionate about the revolution in imaging powered by AI. If you are working on the future of spectral sensing, let's connect.

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