Philippe Monnoyer

Philippe Monnoyer

Deep-Tech Strategist · SEMI Hall of Fame Inductee 2024

Bridging the gap between world-class R&D and industrial commercialization. Specializing in MEMS, Hyperspectral Imaging, and Optical Sensors for HealthTech and Industry 4.0.

About Me

From the Cleanroom to the Boardroom

I am a deep-tech strategist bridging the gap between world-class R&D and industrial commercialization. As a SEMI Hall of Fame Inductee (2024) and Commercial Lead at VTT, my mission is to take complex innovations—specifically in MEMS, Hyperspectral Imaging (HSI), and Optical Sensors—and translate them into scalable solutions for HealthTech and Industry 4.0.

With a PhD in Chemistry and a career spanning Motorola, Freescale, and imec, I have moved from the cleanroom to the boardroom. I understand the physics of the sensor, the challenges of microfabrication, and the business logic required to bring them to market.

I am passionate about the revolution in imaging powered by AI. If you are working on the future of spectral sensing, let's connect.

  • Hyperspectral & AI

    Driving the shift from bulky cameras to handheld, AI-powered diagnostic tools.

  • Ecosystem Leadership

    Chair of the SEMI MEMS & Imaging Sensor Summit. Industrial Liaison for IEEE-WHISPERS.

  • Medical Technology

    Leveraging spectral sensing for non-invasive diagnostics and next-gen healthcare.

  • Community Building

    Founder of the Lippmann Award. Active member of SEMI MSTC and MSEC executive committees.

Curriculum Vitae

Education

PhD in Chemistry

University of Namur, Belgium

Expertise

  • MEMS & Sensors
  • Hyperspectral Imaging
  • Optical Sensors
  • Microlithography
  • CMP Process Development
  • Semiconductor Manufacturing
  • Technology Commercialization

Awards & Recognition

  • SEMI Hall of Fame Inductee (2024)
  • Founder, Lippmann Award

Industry Roles

  • Chair, SEMI MEMS & Imaging Sensor Summit
  • Industrial Liaison, IEEE-WHISPERS
  • Member, SEMI MSTC Executive Committee
  • Member, SEMI MSEC Executive Committee

Professional Experience

Commercial Lead

VTT Technical Research Centre of Finland
Present
Espoo, Finland
  • Leading operations in microelectronics and cleanroom technologies
  • Driving commercialization of MEMS, hyperspectral imaging, and optical sensor innovations
  • Bridging R&D with industrial applications for HealthTech and Industry 4.0

Process Development Engineer

imec
Previous
Leuven, Belgium
  • CMP process development for advanced semiconductor nodes
  • Barrier slurry composition development for low-k dielectrics
  • Optical microlithography research

Process Engineer

Freescale Semiconductor (formerly Motorola)
Previous
  • Semiconductor process development and manufacturing
  • Microlithography and microfabrication processes

Researcher

Rowland Institute at Harvard
Previous
Cambridge, MA, USA

Holographic recording and advanced optical systems research

Researcher

Space Center of Liège
Previous
Liège, Belgium

Microlithography and holographic recording for space applications

Selected Work

Click on a category to explore

Method and Apparatus for Calibrating a Spectral Imaging Device
WO2023062275 · 2023
A Device for Non-Invasive Monitoring
WO2022301240 · 2022
"Universal" Barrier CMP Slurry for Use with Low Dielectric Constant Interlayer Dielectrics
WO2007087831A1 · 2007
Barrier Slurry Compositions and Barrier CMP Methods
WO2007102138A3 · 2007
Coupling Layer Composition for a Semiconductor Device
US20160172240A1 · 2016
Rinse Formulation for Use in the Manufacture of an Integrated Circuit
US20100273330A1 · 2010
Method for Testing a Slurry Used to Form a Semiconductor Device
US8061185B2
NATO Science & Technology Organisation – Lecture at the NATO Summer School
Helsinki, 2024 · Watch Video
Making Hyperspectral Imaging Accessible to All
Optics & Photonics Days · Helsinki, May 2024
Hyperspectral Imaging: Vision Redefined for a Technicolor Future
Scandinavian Sensor Summit · Horten, Norway, Sept 2023 · Watch Video
Bridging the Spectrum: Making Hyperspectral Imaging Accessible to All
IEEE-WHISPERS Hyperspectral Imaging Conference · Athens, 2023
Hyperspectral SWIR Imaging for Consumers
SEMI MEMS & Imaging Sensors Summit · Grenoble, 2022
EPIC Technology Meeting on Hyperspectral Imaging
2020
A Spectrometer in Each Pixel
EPIC Meeting in Vision · 2018
Sensing Technology for Food and Agriculture
Sensors in Food and Agriculture · Cambridge, 2016
Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, H., et al. · IEEE ESTC · 2014
Wafer-level SLID bonding for MEMS encapsulation
Xu, H., et al. · Adv. Manuf. · 2013
Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias
P. Dixit, et al. · IEEE IMPACT · 2013
Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, H., et al. · European Microelectronics Packaging Conference · 2013
Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias
P. Dixit, et al. · J. Micromech. Microeng. · 2012
Low-temperature bump bonding of Timepix readout chips and CdTe sensors
H. Heikkinen, et al. · IEEE Nuclear Science Symposium · 2011
Optical extensions towards the 45-nm node
E. Hendrickx, P. Monnoyer, et al. · Proc. SPIE · 2004
ArF solutions for low-k1 back-end imaging
V. Wiaux, P. Monnoyer, et al. · Proc. SPIE · 2003
Structural Characterization of Colloidal Ag2Se Nanocrystals
V. Buschmann, Ph. Monnoyer, et al. · Langmuir · 1998
Preparation of colloidal nanocrystals of AgX and Ag2Se from microemulsions
Ph. Monnoyer, et al. · Colloids Surf. A · 1996
Preparation of colloidal AgBr particles from microemulsions
Ph. Monnoyer, et al. · Colloids and Surfaces A · 1995
Announcing 2025 Lippmann Award Winner: Hypervision
Read on LinkedIn
Non-Invasive CGM Technology: Who's in the Race?
Read on LinkedIn
New Year's Resolutions: What About Measuring Some Data?
Read on LinkedIn
Announcing Kuva Space – Winner of the Lippmann Award 2024
Read on LinkedIn
The Imaging Revolution at VTT
Read on LinkedIn
The Revolution in Continuous Glucose Monitoring
Read on LinkedIn
Skin Cancer: New Technology from Finland
Read on LinkedIn

Get in Touch

I am passionate about the revolution in imaging powered by AI. If you are working on the future of spectral sensing, let's connect.

Connect on LinkedIn Send Email